STACKPOLE RHC2512 high power chip utilizes unique materials, design, and processing to lower thermal resistance. When used with the recommended solder pad layout, device will typically show a heat rise of 60C per watt compared to standard 2512 devices that can experience more than 120C per watt. Device is more stable at higher power and higher temperatures, demonstrated by the lower resistance shifts over load life and overload testing. This high power performance is a popular choice for power electronic and control applications such as buck converters, HUD systems, IR goggles, HVAC controls, audio controls, and motor and pump controls.
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