January 05, 2023
High Density Interconnect Socket Warpage
Prediction and Characterization
Hosted by International Electronics Manufacturing Initiative (INEMI)
High density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited computation that maintains the required level of accuracy is needed to shorten socket design cycles.
of iNEMI’s High Density Interconnect Socket Warpage Prediction and Characterization project established an analysis and validation framework for socket development, conducted simulation experiments, and initially investigated the impact of socket design, fiber filled material properties and molding process conditions on socket warpage.
will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and will ultimately establish guidelines for dynamic socket warpage measurement and prediction. If you are involved in socket design and development, board assembly and/or reliability, this project will be of interest to you. Please join us to learn more on January 5 or 6. The deadline to sign up for the project is February 17, 2023.
This webinar is open to industry; advance registration is required (see links below
). For additional information, contact Haley Fu (email@example.com
7:00-8:00 a.m. EST (Canada)
8:00-9:00 p.m. EST (Canada)
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