Electronic Products & Technology


GaN Reliability in Space Applications

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August 09, 2023

Sumer of GaN Webinar Series

The ‘Summer of GaN’ continues with the third installment of this webinar series focused on reliability in real-world applications.

Join us on August 9th at 10:00 am (Pacific) on the topic of “GaN Reliability in Real-World Applications: Using Test-to-Fail Methodology to Accurately Predict Projected Lifetime of GaN FETs and ICs in Space Applications.”

During this webinar, we will delve into how the Test-to-Fail methodology enables precise projection of the lifetime of GaN FETs and ICs in space applications including DC-DC conversion, motor drives, lidar, and electric propulsion.

Join the webinar to learn more about:

  1. Introduction to GaN technology and its advantages in space applications.
  2. In-depth exploration of the Test-to-Fail methodology and its applicability in accurately forecasting the projected lifetime of GaN FETs and ICs in the extreme conditions of space.
  3. Real-world results showcasing the exceptional reliability of GaN devices in space applications.
  4. Question and answer session to address your specific queries and concerns.

Using Test-to-Fail Methodology to Accurately Predict Projected Lifetime of GaN FETs and ICs in Space Applications

Date: August 9, 2023

Time: 10:00 AM PDT

Duration: 1 hour

Hosted by Efficient Power Conversion Corporation


Dr. Shengke Zhang is Vice President of Product Reliability at EPC, where he leads the conduction of failure analyses for all GaN transistors and ICs. Prior to joining EPC, he worked as Sr. Failure Analysis Engineer on RF-MEMS devices in the mobile industry. He earned his Ph.D. degree in Materials Science and Engineering from Arizona State University in 2016, under Dr. Nathan Newman, in investigating low-loss dielectrics for cellular and advanced computing applications. He received his B.S. degree from Huazhong University of Science and Technology 2011. He was the author and co-author of more than 20 technical papers. He is also a committee member and internal liaison for JEDEC’s JC-70 Wide Bandgap Power Electronic Conversion Semiconductors Committee.

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