Electronic Products & Technology



News
September 30, 2019 by EP&T Magazine

ATS Design Services delivers cool solutions to Digi-Key customers

Advanced Thermal Solutions Inc. (ATS), Norwood MA, a leading developer of products and systems for cooling electronics, is now providing design engineering services for electronic components distributor Digi-Key Electronics.  Through its Design Services Provider network ATS provides comprehensive thermal analysis…
Product
September 26, 2019 by Stephen Law

EC fans come with spark proof IP68-ATEX certification

ORION FANS OA254EC-ATEX Series Electronically Commutated (EC) fans includes a 254mm IP68-ATEX rated version for water-proof and harsh environment applications. The low-power unit combines energy conservation with maximum protection for power-hungry applications involving explosive atmospheres or flammable gases. Constructed for…
Product
August 27, 2019 by Stephen Law

4-Watt thin film serves high power applications

FUJIPOLY AMERICA Sarcon 30YR‐c compliant silicone thin film is suitable for filling near‐microscopic air gaps that exist between high-power heat generating components and heatsinks. By increasing surface area contact, it is possible to measurably improve cooling effectiveness and operational performance.…
News
August 22, 2019 by Tom Abate, Stanford University

Heat shield protects electronic devices

Atomically thin materials could create heat-shields for cell phones or laptops that would protect people and temperature-sensitive components and make future electronic gadgets even more compact.
Product
August 15, 2019 by Stephen Law

Heat pipes cool hot components

ADVANCED THERMAL SOLUTIONS Line of flat and round copper heat pipes for electronics thermal management includes more than 350 standard units that provide stand-alone cooling and can be combined with heat spreading devices to deliver high levels of passive or…
Product
May 31, 2019 by Stephen Law

Advanced material boosts high-temperature performance in electronics

GREENE TWEED ArlonÒ 3000 XT thermoplastic for electronics applications provides improved thermal stability and chemical resistance, very low moisture absorption, very low wear and high impact resistance. The cross-linked, semi-crystalline polyketone solution delivers improved high-temperature performance over other plastics used in…
Product
May 19, 2019 by Stephen Law

Ultra-compressible putty lowers thermal resistance

FUJIPOLY AMERICA Sarcon PG80A compressible, high-performance thermal interface material is an advanced putty-like, gap filler pad that exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13W/m°K. Product requires very low compression force…
Product
April 23, 2019 by Stephen Law

Thermal fuse available with shunt

SCHURTER RTS thermal fuse for SMD mounting is available with an integrated shunt. The compact overtemperature protection device serves power semiconductors used in high density, high performance circuit boards to protect against thermal runaway. In such an event, the thermal…
Product
April 18, 2019 by Stephen Law

TCO devices boost current capacity in small package

BOURNS SC series of miniature Thermal Cutoff (TCO) devices are lighter, smaller and offer high current capacity up to 13A at 25°C. Product family matches the small space and over-temperature protection needs in next-generation Lithium-ion (Li-Ion) battery cells and USB…
Product
April 6, 2019 by Stephen Law

Ultra-soft thermal gap filler is compressible

FUJIPOLY Sarcon PG25A soft and compressible thermal gap filler materials provide gel like consistency in a convenient sheet form. Product is suitable for applications that have delicate components and high compression rates. When it is sandwiched between components of varying…
Product
March 4, 2019 by Stephen Law

Electronically commutated (EC) fans deliver rugged performance

ORION FANS EC IP68-ATEX electronically Commutated (EC) fan series includes spark proof IP68-ATEX rated versions for applications involving explosive atmospheres or flammable gases. Implementing IP68-ATEX fans into a design eliminates the possibility of an explosion or fire. Available in a…
Product
February 6, 2019 by Stephen Law

Ultra-low modulus thermal interface materials contain advanced resin

HENKEL BERGQUIST GAP PAD thermal interface materials (TIMs) comes in two ultra-low modulus, including TGP 6000ULM and TGP 7000ULM, both formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0…