Electronic Products & Technology

September 26, 2018 by Stephen Law

Assembly film boosts reliability, adhesion at high temps

HENKEL LOCTITE ABLESTIK CF 3366 epoxy-based, silver-filled film adhesive provides high thermal and electrical conductivity, delivering improved heat dissipation capabilities for robust thermal management. Leapfrogging other commercial assembly films, product addresses miniaturization trends, increasing power density demands and high operating…
September 17, 2018 by Stephen Law

Strong epoxy adhesive is thermally stable

MASTER BOND EP70CN two part, thermally stable epoxy adhesive is formulated using a natural, renewable and sustainable ingredient. Epoxy system forms high physical strength bonds and can be utilized for bonding, sealing, coating and potting. Product’s tensile strength is 11,000…
March 28, 2018 by Stephen Law

Curable epoxy adhesive seals, coats, encapsulates

MASTER BOND EP42HT-3AO Two part, room temperature curable epoxy adhesive, sealant, coating and encapsulating system is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Product is relatively easy to use with a forgiving 100 to 40…
May 30, 2017 by Stephen Law

Cyanocrylate adhesive combines dual bond and quick cure

NTE ELECTRONICS SureHold 78-22021 Helios Light Cure Cyanocrylate Adhesive combines a dual bonding technology and a premium high quality glue with a speedy light cure. Industrial strength product cures with UV/visible light in instant and photo-cure. Suitable for sensitive electronic…
May 4, 2017 by Stephen Law

Adhesive fixes, strengthens optoelectronic applications

DELO  DUALBOND OB786 is particularly suited for fixing components within seconds while ensuring precision and high strength in optoelectronic applications. After an irradiation time of less than one second, the build-up of adhesion is already significant; after five seconds, the…
January 5, 2017 by Stephen Law

Fast cure conductive adhesive for small to medium-size chip bonding

EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small to medium-size die and tantalum capacitors cures in one minute at 170ºC. Adhesive is stress-absorbing, designed to withstand the rigors of thermal cycling and improves conductive stability. Material can…
May 5, 2016 by Stephen Law

Dual-curing adhesives achieve full strength at 60°C

DELO DualBond dual-curing adhesives reach full strength at only 60 °C after prefixation by light. Product range is completed by adhesives curing in a single step at low temperatures, three times faster than previous products. The epoxy resin-based adhesives are mainly…