EP39MAOHT: Two Part, Low Exotherm Epoxy for Potting & Casting Applications
EP39MAOHT possesses low exotherm, exceptional thermal conductivity, and other wide-ranging capabilities suitable for heat-sensitive electronics. Watch our video for in-depth insights.
EP40TCMed: Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. This sterilization resistant compound is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications.
Supreme 3DM-85: One Part, Toughened Epoxy for Bonding, Sealing and Dam-and-Fill Encapsulation
Supreme 3DM-85 can be used for applications where a non-mixed epoxy is desirable and heat curing above 200°F is not possible. Aside from its use as an adhesive, it is also used for chip on board encapsulations. After curing, it blocks the flow of a second epoxy that is is meant to encapsulate chips and wire bonds.