Electronic Products & Technology

UV cure adhesive passes rigorous reliability requirements

December 8, 2016  Stephen Law

ENGINEERED MATERIAL SYSTEMS 535-11M-12 UV cured epoxy is formulated to pass rigorous reliability requirements. Product is a screen printable version of the 535-11M-7 UV cure adhesive and is designed to eliminate any warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Product can be used for lens bonding, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly. http://www.emsadhesives.com

ems-dam-fill-encapsulants


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