Ultra-compressible putty lowers thermal resistance

FUJIPOLY AMERICA Sarcon PG80A compressible, high-performance thermal interface material is an advanced putty-like, gap filler pad that exhibits a thermal resistance as low as 0.08°C•in2/W at 14.5 PSI with a thermal conductivity of 13W/m°K. Product requires very low compression force at high compression rates making it suitable for applications that have delicate or wide-variation component heights requiring material compression between 30% and 90%. Product is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a maximum dimension of 300mm x 200mm. Sarcon® PG80A can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40 to +150°C.