Transient liquid phase sintering paste is lead-free
ORMET CIRCUITS DAP-491-1 Transient Liquid Phase Sintering (TLPS) pastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly. The Pb-free paste is formulated for attachment of metalized die to metalized substrates. It is processed via lead-free reflow, but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting. Product serves as alternative to gold-based and lead-based solders, as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.