Electronic Products & Technology

Toughened epoxy system bonds, seals, coats, encapsulates

July 10, 2019  Stephen Law

MASTER BOND Supreme 3CCM-85 toughened, one part epoxy system can be used for bonding, sealing, coating and especially glob tops and small encapsulation. The curing temperature for this system is 175-185°F for 2 to 3 hours, rather than the typical curing temperature of 250-300°F for a one-part epoxy. This allows the product to be used in applications where plastic substrates are sensitive to temperatures exceeding 200°F. Made with a viscosity and flow profile, product is not premixed and frozen and its working life is unlimited at room temperature. Product bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. Delivering good physical strength properties, the service temperature range for this system is from -100°F to +350°F.

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