Top-side cooling packaging shrinks RF power, 5G radios
Stephen LawPower Supply / Management Semiconductors Wireless 5G NXP power RF semiconductor wireless
NXP SEMICONDUCTORS Family of top-side cooled RF amplifier modules are based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. The smaller base stations can be more easily and cost-effectively installed, and blend more discretely into their environment. NXP’s GaN multi-chip module series, combined with the industry’s first top-side cooling solution for RF power, helps to reduce not only the thickness and weight of the radio by more than 20 percent, but also the carbon footprint for the manufacture and deployment of 5G base stations. Devices deliver significant design and manufacturing benefits, including the removal of the dedicated RF shield, use of cost-effective and streamlined printed circuit board, and separation of thermal management from RF design. These features help networking solution providers create slimmer and lighter 5G radios for mobile network operators, while reducing their overall design cycle.