TIM adhesive lowers thermal stress, resistance

HENKEL Bergquist Hi Flow THF 5000UT phase change film marks a milestone in thermal management materials development (TIM), allowing for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface. Product demonstrates low thermal impedance across various bond line thicknesses at both ultra-low and higher pressure (0.04° C-cm2/W at 35psi, 0.06° C-cm2/W at <10psi), delivers improved reliability as evaluated up to 150°C, and achieves thermal conductivity as high as 8.5W/m-K.

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