Thin film interface materials boost thermal conductivity

FUJIPOLY  Sarcon GAR line of high-performance, glass fabric reinforced thin film thermal interface materials deliver a high thermal conductivity (3.0 W/m°K), while exhibiting a thermal resistance as low as .17°Cin2/W. Product is suitable for complex die-cut shapes and exerts a low force on components, as it fills near‐microscopic air gaps between the heatsink and board-level heat sources. This increases surface contact and measurably improves the cooling performance of the heatsink. Product is recommended for applications with operational temperatures that range from ‐40°C to +150°C. Product comes in three thicknesses (0.2, 0.3, and 0.45mm) and is offered in rolls, pre-cut sheets or can be die-cut to the exact shape required. http://www.fujipoly.com