Electronic Products & Technology

Thick-film heat sink device delivers non-inductive, high heat dissipation

July 5, 2020  Stephen Law

TEPRO TO-220 non-inductive, thick-film heat sink resistor in the TO-20 Type comes with enhanced power size ratio, high stability and optimum heat dissipation. Miniature device that features a plated copper heat sink, a high stability thick-film element and tinned copper leads. It also has high temperature thermoset molding, and is suitable for use in switching power supplies and various types of pulse circuits. Custom models are available with variations in lead length, tolerance to 0.5%, and temperature coefficients. It is terminal strength tested at a 5lb. pull and its solderability and solvent resistance meet MIL-STD-202 requirements. 

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