Thermally conductive underfill epoxy lowers viscosity to 5,000-15,000 cps

MASTER BOND EP3UF-1 single component epoxy is not premixed or frozen and provides a low viscosity of 5,000-15,000 cps. The heat curable thixotropic compound is suitable for underfill and many bonding applications. Product delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000psi and a tensile modulus of 450,000-500,000psi. Product has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], making it an effective thermal interface material. Product contains a special filler with a small particle size, allowing it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6K•m2/W.