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Thermally conductive solution transfers heat through encapsulating layer


HENKEL  Technomelt thermally conductive material provides ability to transfer heat through the encapsulating layer and delivers dual-function performance in a single material solution. Product serves as a streamlined alternative to multi-step, messy potting processes. Materials can be melted, molded and cooled quickly under low pressure, delivering an encapsulation technique that provides a high throughput solution for protection of delicate circuitry and pcb assemblies, while forming a self-enclosed housing.  http://www.henkel-adhesives.com/electronics

16MYD263_ENC

 


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