Electronic Products & Technology

Thermally conductive potting compound resists high temperatures

October 15, 2019  Stephen Law

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is not as stiff as conventional epoxies that withstand extreme temperatures. Product has a noteworthy strength profile with a tensile modulus of 750,000 to 850,000 psi at room temperature and a compressive strength of 26,000 to 28,000 psi. Its thermal conductivity is 4-5 BTU•in/(ft2•hr•°F), and it is also electrically non-conductive. Shrinkage upon cure is exceptionally low.

Print this page

Related Stories

Leave a Reply

Your email address will not be published. Required fields are marked *