Thermally conductive, electrically non-conductive epoxy has low outgassing
MASTER BOND EP40TC two part epoxy system is designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], product is formulated with a small particle size filler making it suitable for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm. Product meets NASA low outgassing specifications, a prerequisite for many aerospace, electronic and optical applications. Serviceable from -100°F to +300°F, system resists thermal cycling, vibration and shock. Product exhibits a high peel strength of 40-60 pli and Shore D hardness of 70-80 at 75°F. It features a convenient 1:1 mix ratio, and cures in 2-3 days at room temperature or faster with the addition of heat. Compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics.