Thermal profile system captures electronic assembly profile
September 30, 2021 Stephen Law
SOLDERSTAR VP Nano system allows engineers to capture thermal profiles of complex electronic assemblies that utilize numerous components or require higher mass pcb substrates. System’s design will streamline the periodic checking of the vapor phase machines and ensure uniform heating of the boards being soldered. System includes a state-of-the-art re-chargeable micro miniature datalogger and improved thermal shield for improved security and protection within the oven.
