Thermal products deliver heat-transfer between components, heat sinks

3M Thermally Conductive Adhesive Transfer Tapes boost adhesive performance with improved wetting and flow onto many substrate surfaces, providing thermal conductivity and electrical insulation properties.

Thermally Conductive Silicone Interface Pads (TCSIP) consist of a highly conformable and slightly tacky silicone elastomer sheet filled with conductive ceramic particles that help to provide enhanced thermal conductivity and excellent electrical insulation performance.

3M Thermally Conductive Epoxy Adhesive, a two-part epoxy, uses a high-performance filler to ensure good thermal conductivity with high adhesion.

Thermally conductive acrylic interface pad is designed to provide a preferential heat transfer path between heat-generating components like IC chips or EV batteries and a heat spreader.

The specialized chemistry of all of these adhesive tapes and pads render them modestly soft, allowing them to conform well to non-flat substrates.

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