Electronic Products & Technology


Thermal interface material is soft touch, high-performance

FUJIPOLY Sarcon PG80A high-performance, low compression force putty-like thermal interface material provides 13 W/m°K gap filler pad and gently conforms to most component shapes and uneven surfaces to transfer heat from its source to a nearby heat sink or spreader while exhibiting a thermal resistance as low as 0.08°Cin2/W at 14 PSI. Product is suitable for applications that have delicate or wide-variation component heights and require material compression between 30% and 90%.  PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0mm) up to a maximum dimension of 300mm x 200mm. http://www.fujipoly.com




Request more information

  • This field is for validation purposes and should be left unchanged.

Print this page