Electronic Products & Technology

Thermal gap filler material conforms to gaps

EP&T Magazine   


FUJIPOLY AMERICA Sarcon GR-SL low compression and high-performance thermal gap filler material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point when placed on top of uneven components. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat. Product’s formulation provides a thermal conductivity of 2.7 W/mK with a thermal resistance between 0.94 and 1.69 Cin2/W depending on sheet thickness. The V-0 tested product is available in 2.5 or 5.0mm thick sheets up to a maximum 200x300mm dimension and has an operating temperature of -40 to +150C.



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