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Thermal gap filler eliminates performance-hindering air gaps


FUJIPOLY SARCON SPG-30B form-in-place thermal gap filler eliminates performance-hindering air gaps ranging from .08mm to 1.0mm. Product delivers improved thermal conductivity of 3.1 W/m°K with a thermal resistance of 0.33°Cin2/W. The ultra-low compression force silicone compound completely fills all spaces, gaps and protrusions when compressed between a heat source and a nearby heat sink or spreader. The material is easy to apply and does not require heat curing. Product also exhibits improved vibration absorption and electrical insulation properties. http://www.fujipoly.com


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