Thermal gap filler is easy to apply, form-in-place

FUJIPOLY  SARCON SPG-20A is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W. When applied between heat-generating components and a nearby heatsink or spreader, the form stable thermal material completely fills unwanted gaps as small as 0.08mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance. Product serves as an alternative to thermal grease due to its superior handling properties.