Thermal conductivity adhesive improves flexibility
LORD MT-815 high thermal conductivity adhesive is low modulus and adds flexibility. Product can be used as a thermal adhesive for large die, in die attach applications, or as a solder replacement. Product has a modulus of <1GPa, allowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles. Product achieves thermal conductivity of >10 W/m-K.