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Temperature stable solder comes in low-voiding formulation


HENKEL LOCTITE GC 18 solder material is a low-voiding formulation designed for use with multiple component sizes and types, including large, thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Product is available in Type 3 and Type 4 pastes, halogen-free and lead-free. Product provides the comprehensive temperature stability benefits inherent with the firm’s GC platform, delivering sustainability, reliability and low cost of ownership. 


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