Substrate enables bonding silicon-nitride-based ceramics with copper foils

HERAEUS ELECTRONICS Condura ultra Ag free AMB Substrate enables bonding silicon-nitride-based ceramics with copper foils. Developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology. Product is designed to provide improved reliability and processing (e.g., sintering, bonding, soldering). Product’s cost-efficient high-performance comes with standard and thick Cu layers and thermal conductivity of ≥60 W/m.K and ≥80 W/m.K.

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