Solder’s wetting characteristics eliminate NWO (HiP) defects

AIM SOLDER H10 halogen-free no clean solder paste delivers fine feature printing, improved electrochemical reliability and improved wetting. Product is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours. Product’s effective wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. Product’s reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, paste is robust, stable, and easy to implement.

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