Solder paste printer boosts processing flexibility
Stephen LawElectronics Production / Materials equipment production
ASMPT DEK TQ series solder paste printing platform delivers flexibility in the processing of large printed circuit boards, measuring up to 600 by 510 millimeters. Unit operates with an alignment accuracy of ±12.5 microns @ 2 Cmk and wet printing accuracy of ±17.0 microns @ 2 Cpk. Designed with firm’s motto of ‘Maximum performance and flexibility in the smallest footprint’. Users can place two machines back-to-back to double their line’s productivity without increasing its length. Product’s printable area measures 560 by 510 millimeters, and comes with a three-stage conveyor.