HENKEL LOCTITE GC 10 temperature stable solder paste does not dry out prematurely or clog fine-pitch apertures during the course of a daily production run. Product provides consistent results with no refrigeration and overcomes the processing and performance challenges experienced by conventional solder paste products. Product is temperature stable at 26.5°C for one year and stable at temperatures of up to 40°C for one month. Product has abandon times of up to 24 hours, a stencil life of up to 72 hours and zero startup time. Formulation of the material delivers stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150°C and 200°C. http://www.henkel.com/electronics
