Electronic Products & Technology

Solder paste extends reflow profiles

EP&T Magazine   


COBAR SN100C-XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. Product provides improved wetting on all common pad finishings and yields shiny joints reminiscent of leaded solders. Product also exhibits a robust printing window. Product performs better in eliminating voiding when compared to SAC-alloys.



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