Solder paste boosts thermal fatigue resistance

SHENMAO AMERICA PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste is formulated with firm’s Sn/4Ag/3Bi Alloy, designed with high thermal impact reliability for long service life electronic products with high-reliability requirements. The Halogen-free (ROL0) paste complies with RoHS, RoHS 2.0 and REACH, providing improved voiding performance and good printability. Product has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. With the innovative flux design, voiding easily can be controlled to less than 10%. Product can increase thermal reliability performance by a minimum of 30%. It provides better mechanical shock performance than typical solder alloys such as SAC305 and SAC405 and is suitable for use in consumer electronics, servers and automotive electronics applications.

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