Solder cup headers saves space in wire to board applications

MILL-MAX 380-10-1XX-00-002000 (single row) & 480-10-2XX-00-002000 (double row) low profile solder cup headers deliver a 25% reduction in height and are suitable for making wire to board connections where keeping overall height to a minimum is essential. Devices provide a standoff height of 4.7mm, 2.54mm pin spacing and .51mm diameter tails suitable for mating with a variety of sockets or terminating directly to pcb. The insulator material is Nylon 46 with an HDT of 290°C to withstand most soldering processes.