Solder alloy boosts thermal, impact reliability
SHENMAO AMERICA PF906-S and PF912-S series high thermal/drop reliability solder alloys can be used in a wide range of applications. Products have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging processes. PF906-S Sn/Ag4.0/Cu0.5/Bi3.0/Ni0.05 alloy boosts thermal reliability and is designed for use in automotive electronic applications. PF912-S Sn/Ag2.0/Cu0.5/Bi3.0/Ni0.05 alloy boosts thermal and impact reliability compared to conventional solder alloys such as SAC305 and SAC405.
Print this page