SMT connectors serve low profile board-to-board designs
ADVANCED INTERCONNECTIONS Mezza-pede 1.0mm pitch SMT connectors are designed for low profile board-to-board or flex cable-to-board applications where long-term reliability and a compact size are required. Devices provide low profile design with a mated height of 2.92mm. With firm’s enclosed screw-machined socket, 6-finger contact and heavy gold plating, product series passes the 20-day mixed flowing gas (MFG) test required in many telecom and other severe environment and long-life applications. Device’s over-molded lead frame seals the surface mount leads to prevent solder wicking, ensuring a secure solder joint. The low stack height makes it suitable for tight mezzanine packaging applications.