SMT adhesive allows self alignment of solder, components
KOKI JU-R2S self alignment type SMT adhesive for double-sided reflow allows self alignment of solder and components. Product prevents component falling in double-sided reflow. Product will not inhibit the self alignment and natural sinking of the component during waiting in the first reflow. Product eliminates the 1st curing process and withstands the higher reflow profiles of today, while eliminating dangerous good costs, having achieved the UN transport class designation. Product cures in the same lead free reflow profile, eliminating a curing step. It has the ability to self center in the reflow process.