Sinter paste boosts thermal conductivity

HERAEUS mAgic DA295A sinter paste improves thermal conductivity and enables power electronics to operate at elevated temperature and extends device lifetime. Product is a low temperature, non-pressure sintering solution designed to achieve improved die-attach properties for high power, high reliability applications. The improved micro-Ag formulation further widens processing window to reduce overall cost of ownership. Product is lead-free and contains zero halogen, while improving dispensing performance – no cleaning required.

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