Silicone gap filler transfers heat, absorbs electromagnetic waves
Stephen LawElectronics Production / Materials materials production
FUJIPOLY AMERICA SARCON EGR30A thermal interface material absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of the product makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks. Product also enhances absorption effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 3.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.65 K-cm2/W at 14.5 PSI. This versatile material is available in five sheet thicknesses (0.5, 1.0, 1.5, 2.0 and 2.5mm) up to a maximum dimension of 300mm x 200mm.
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