FUJIPOLY AMERICA Sarcon GR25B advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5W/m•K and is a popular choice for higher power electronics applications. Product is offered in double sticky surfaces, hardened surfaces for easier handling, with polyester mesh to prevent stretching or with both hardened surface and mesh for more complex assemblies. Depending on application gap size and material thickness, thermal resistance will range from 0.19 to 1.80 K-in2/W. The gap filler’s soft consistency gently conforms to uneven surfaces and components to efficiently transfer heat to a nearby heatsink. Product comes in thicknesses from 0.30mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm.