Sensor system ensures optimal heat sink efficiency
SENSOR PRODUCTS Tactilus heat-sink analysis system quickly tests and corrects the surface contact and pressure distribution between the heat sink and its source. Users can visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, product maps and measures the changing pressure distribution between the mating surfaces and displays it through its software. Product is flexible and 0.015-in. thick (0.38 mm), allowing it to be placed between the CPU and heat sink without affecting the assembly. The sensor pad has 625 resistive sensing points arrayed on a 25×25 grid.