VISCOM X8011 PCB X-ray inspection systems delivers analysis results that can be verified with ease and unspecified defects can be automatically pinpointed and re-examined in detail. Unit covers all examination needs in the SMD production sector. Specifically developed for assembly inspection, unit provides maximum granularity and highest image quality. The XMC analysis software allows for convenient operation, containing several automatic analyses such as BGA, QFN and inspection, as well as void calculation.
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