Semi-sintering die attach paste serves power package applications
HENKEL LOCTITE ABLESTIK ABP 8068TD high thermal die attach paste is developed for use in applications where no die back-side metallization (BSM) is required, although can be used if desired. Material’s adaptability gives semiconductor companies a high thermal conductivity die attach option for bare silicon (Si) die integration and is particularly well-suited for high power applications. material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive. material is compatible with different die – whether metallized or not. Product extends the benefits of semi-sintering to a wider variety of power packages using different types of die and lead frame finishes.