Electronic Products & Technology

Semi-sintering die attach paste serves power package applications

June 14, 2021  Stephen Law

HENKEL LOCTITE ABLESTIK ABP 8068TD high thermal die attach paste is developed for use in applications where no die back-side metallization (BSM) is required, although can be used if desired. Material’s adaptability gives semiconductor companies a high thermal conductivity die attach option for bare silicon (Si) die integration and is particularly well-suited for high power applications. material allows packaging specialists to satisfy the requirement for high heat dissipation in applications where bare silicon die are used, particularly in situations where back-side metallization processes are cost- or process-prohibitive. material is compatible with different die – whether metallized or not. Product extends the benefits of semi-sintering to a wider variety of power packages using different types of die and lead frame finishes.

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