Electronic Products & Technology

Semi-automated bonding system is accurate to 3m

EP&T Magazine   


FINETECH FinePlacer matrix ma semi-automated bonding system provides 3µm placement accuracy across large substrates such as 12 inch wafers, which opens an extra wide spectrum of possible applications. Product provides high accuracy, generous working distance, innovative detail solutions such as tool shifting, HD process video module, the process integrated CleverDispense system, automated processes. Unit delivers preconditions for three-dimensional stacking of hybrid sub-assemblies like MEMS/MOEMS and various C2W applications.



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