Electronic Products & Technology

SD card level translator has 40% smaller footprint

Stephen Law   

Electronics IC semiconductor

NEXPERIA NXS0506UP Secure Digital (SD) card level translator IC  is housed in a 16-bump wafer-level chip-scale package the SD 3.0-compliant bi-directional dual voltage level translator has a footprint measuring 1.45mm x 1.45mm x 0.45mm, 0.35mm pitch, 40% smaller than previous 20 bump devices. Device features integrated auto-direction control, EMI filter and IEC  61000-4-2 ESD protection. Device is designed to operate at clock frequencies of up to 208 MHz and data rates of up to 104Mbps. Product features integrated pull-up and pull-down resistors to reduce the BOM cost. Devices provide direct connection to latest host CPU/SOC ASICs, and are easy to use because DATA and CMD channels are swappable without impacting functionality.

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