RF system-in-package aids low power IoT designs

ON SEMICONDUCTOR AX-SIP-SFEU programmable RF transceiver System in Package (SiP) integrates an advanced RF System-on-Chip (SoC) with all surrounding Bill of Material (including a TCXO). Device provides the integrated Sigfox solution for both uplink (transmit) and downlink (receive) communications. Product range of ready-to-use, turnkey radio frequency (RF) solutions supports applications requiring Internet of Things (IoT) connectivity. The 7mm x 9mm x 1mm SiP transceiver has almost one-third the footprint and is one-tenth the overall size of a module-based solution, providing greater design freedom.