Electronic Products & Technology


Rework system meets array package challenges

OK INTERNATIONAL Scorpion Rework System meets the challenges of array package rework and the accurate placement of ball grid arrays (BGAs) while allowing for simultaneous viewing of printed circuit board pads and component pads or balls. Unit provides accurate component placement and can create specifically tailored reflow profiles through firm’s convection heating technology with nozzle and dual-zone preheater in one user-friendly, single platform rework system.


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