FUJIPOLY AMERICA Sarcon 100GR-FL low resistance and highly durable thermal interface gap filler pad is comprised of a gel-like material manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. The true-to-form gap filler pad is easy to install and increases productivity compared to non-reinforced alternatives. Product will transfer heat with a thermal conductivity of 2.8W/m-K and a thermal resistance of .67°Cin2/W at 14.5 PSI when placed between a heat source such as a high-performance semiconductor and a nearby heat sink. The 1.0mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.
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