Electronic Products & Technology

Refrigerant-free, thermoelectric coolers boost performance in enclosures

EP&T Magazine   

Electronics Thermal management cooler thermal management thermoelectric

LAIRD THERMAL SYSTEMS SuperCool X Series next-gen high-performance thermoelectric cooler assembly series utilizes advanced semiconductor materials. This enhancement boosts cooling performance by up to 10% over previous models. In combination with a high-performance heat sink and fan shroud assembly, product can transfer heat to ambient environments more rapidly than legacy systems. Units are designed for sample storage compartments commonly found in analytical instrumentation or medical diagnostic chambers with tight geometric space constraints.

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