Reflow oven suits small to medium volume SMT production
APS NOVASTAR ERO-500 Reflow Soldering System is a conveyor oven with five vertical heating zones and one cooling zone. Unit was developed for small to medium volume reflow soldering of SMT boards, hybrid boards and curing of glue or thick film pastes. With a maximum system temperature of 320C, reflow profiles can be optimized for lead-free and lead solder profiles. Each heating zone is independently programmable and easily controlled through the on-board LCD system controller.