
Pure CMOS platform enhances fully integrated single-chip, single-die RF front-end ICs
EP&T Magazine
ElectronicsRF Axis Next-generation pure CMOS RF Front-end Integrated Circuits (RFeIC) platform for the wireless and connectivity markets complements firms current BiCMOS RFeIC platform used to enable its portfolio of fully integrated, single-chip, single-die RF front-end solutions. RF architectural template provides front-end solutions for battery-operated wireless devices and for wireless devices with a continuous power supply. CMOS platform is architected for standard and proven 0.18 and 0.25 micron CMOS processes, and for abundant and inexpensive CMOS silicon material.
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